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Failure Modes and Mechanisms in Electronic Packages Cover Image
Failure Modes and Mechanisms in Electronic Packages (Hardcover)
By P. Singh, Puligandla Viswanadham
$220.99
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Die-cutting and Tooling: A guide to the manufacture and use of cutting, embossing and foiling dies, anvils and cylinders Cover Image
Die-cutting and Tooling: A guide to the manufacture and use of cutting, embossing and foiling dies, anvils and cylinders (Paperback)
By Michael Fairley
$148.35
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Peak Plastic: The Rise or Fall of Our Synthetic World Cover Image
Peak Plastic: The Rise or Fall of Our Synthetic World (Hardcover)
By Jack Buffington
$63.00
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Label Design and Origination: Repro and prepress processes Cover Image
Label Design and Origination: Repro and prepress processes (Paperback)
By Robert Shimmin, John Morton
$125.35
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Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research Cover Image
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Hardcover)
By Karl J. L. Geisler (Editor), Bahgat G. Sammakia (Editor)
$221.00
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Label Markets and Applications: A guide to material specifications and regulations for consumer and industrial markets Cover Image
Label Markets and Applications: A guide to material specifications and regulations for consumer and industrial markets (Paperback)
By John Penhallow
$125.35
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Technology of Polymer Packaging Cover Image
Technology of Polymer Packaging (Paperback)
By Arabinda Ghosh
$60.49
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Life Cycle of Sustainable Packaging: From Design to End-Of-Life Cover Image
Life Cycle of Sustainable Packaging: From Design to End-Of-Life (Hardcover)
By Rafael A. Auras, Susan E. M. Selke
$204.00
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Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) Cover Image
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) (Hardcover)
By Avram Bar-Cohen (Editor in Chief), Jeffrey C. Suhling (Editor in Chief), Andrew A. O. Tay (Editor in Chief)
$1,687.50
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Packaging (Food Cycle Technology Source Book) Cover Image
Packaging (Food Cycle Technology Source Book) (Paperback)
By Unifem (Editor)
$21.95
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Materials Experience: Fundamentals of Materials and Design Cover Image
Materials Experience: Fundamentals of Materials and Design (Paperback)
By Elvin Karana (Editor), Owain Pedgley (Editor), Valentina Rognoli (Editor)
$87.44
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Packaging Design: Successful Product Branding from Concept to Shelf Cover Image
Packaging Design: Successful Product Branding from Concept to Shelf (Paperback)
By Marianne R. Klimchuk, Sandra A. Krasovec
$61.88
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